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Solder paste - List of Manufacturers, Suppliers, Companies and Products

Solder paste Product List

1～15 item / All 28 items

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Lead-free solder paste for automotive use

Lead-free solder paste for automotive use

Three unit manufacturers collaborate with a solder manufacturer for joint development! Compared to our conventional products, each performance has significantly improved.

GPS, while designed for automotive use, demonstrates excellent printability. It also shows superior printability in narrow gaps, with no changes observed after rolling. Even under stringent reflow conditions (low-temperature profile), it exhibits significantly better characteristics in wetting properties, void characteristics, and solder ball performance compared to our conventional products.

  • Solder

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Lead-free solder paste

Lead-free solder paste

Improved overall balance, including printability and smudging.

Solder paste that suppresses the generation of solder balls (side balls and capillary balls) during reflow.

  • Other electronic parts
  • others

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McDermid: Introduction to Low Melting Point Solder Paste

McDermid: Introduction to Low Melting Point Solder Paste

Reduce the incidence of HIP and NWO defects! Features of low melting point solder paste are included.

In this document, we introduce "Low Melting Point Solder Paste." It includes sections on "Features of Low Melting Point Solder Paste and Total Cost Reduction" and "Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H)." Additionally, we explain "Drop Impact Resistance Comparison Data" using graphs. Please feel free to download and take a look. 【Contents】 ■ Features of Low Melting Point Solder Paste and Total Cost Reduction ■ Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H) ■ Details of the P.I.H Process ■ Product Lineup Introduction / Drop Impact Resistance Comparison Data ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

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  • Solder

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McDermid Solder Paste "HRL1 OM-550"

McDermid Solder Paste "HRL1 OM-550"

It is a non-eutectic low melting point solder paste for low thermal resistance substrates, components, and large warped semiconductor parts!

The "HRL1 OM-550" is a low melting point solder paste. It is designed to improve yield and reduce component warpage, significantly enhancing the drop shock resistance and thermal cycling resistance, which were weaknesses of conventional low melting point solders. The melting point is significantly lower compared to "SAC305," achieving energy savings in the assembly process by lowering the peak temperature during reflow from 245°C to 185°C. 【Features】 ■ Board life: Continuous printing possible for up to 12 hours ■ Achieves low voids with various packages such as BGA, MLF, and DPAK ■ Dramatically improves macro (H.I.P) defects and NWO (Non-Wet Open) defects through low melting point reflow ■ Compatible with both atmospheric and N2 reflow ■ Adaptable to components using SAC305 alloy *For more details, please refer to the PDF document or feel free to contact us.

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  • Solder

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McDermid Solder Paste "ULT1 OM-220"

McDermid Solder Paste "ULT1 OM-220"

It is suitable for various applications, such as products where substrates and components with low heat resistance may be mounted!

The solder paste "ULT1 OM-220" is a super low melting point product developed for mounting on substrates and components with low heat resistance. It allows for mounting at a peak temperature of 150°C or lower during reflow, enabling secondary mounting without re-melting boards that have been mounted with "SAC305." This product is suitable for various applications, including consumer electronics, in-cabin automotive products, and medical products, where there is a possibility of mounting on substrates and components with low heat resistance. 【Features】 ■ Peak temperature during reflow: 150°C or lower ■ Mounting of low-cost substrates and components ■ Reduced warpage of substrates and components during mounting compared to SAC (Sn/Ag/Cu) solder ■ Excellent electrical reliability (clears JIS Z 3197 and J-STD-0004B surface insulation resistance tests) ■ Low voids (meets IPC-7095 Class 3: BGA) *For more details, please refer to the PDF document or feel free to contact us.

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  • Solder

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McDermid Alpha Solder Paste Innolot

McDermid Alpha Solder Paste Innolot

High reliability, high heat-resistant lead-free alloy solder paste

Innolot is a SAC-based alloy designed for use in harsh environments (high temperature, vibration) that exceed the reliability performance of standard SAC alloys. ALPHA CVP-390 Innolot incorporates InnoLot alloy into a zero-halogen, no-clean solder paste flux system, providing excellent pin test characteristics and the ability to meet the most stringent electrochemical reliability standards. This product is designed to enable consistent fine-pitch printing, capable of being printed with a stencil thickness of 100um down to 180um circles. Additionally, its superior printing volume deposition reproducibility offers value by reducing defects associated with variations in the printing process.

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  • Solder

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Lead-free solder paste and lead-free resin-containing solder fine solder.

Lead-free solder paste and lead-free resin-containing solder fine solder.

Reduce solder balls to the limit!! Achieve both high-temperature wettability and initial wetting properties!!

With innovations in implementation technologies such as SMT and high density, our solder paste continues to evolve. We offer a variety of lead-free and lead-containing solders, as well as fluxes that meet JIS standards, including A-grade, B-grade, low-spatter types, high-workability types, and high-reliability types. For more details, please contact us or refer to our catalog.

  • Solder
  • Other consumables

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